某500强企业
expert, DB-TCB
电子技术/半导体/集成电路
生产/制造/工艺技术
上海
40 - 50K15薪
职位描述
Expert, TQC
Job Purpose
The TQC members will be the senior experts with advanced packaging process knowledge. Candidate has a passion of innovation and invention to create and drive solutions through new process. Previous hands-on experiences in working cross-functional teams by technical expertise to bring new process to new product manufacturing is desired. Successful candidate should have experience with advanced packaging process enabled by new or renovated process. Candidate should have experience in working with various internal teams and vendors for state of the art process and problem solving of emerging issues.
Job Responsibilities
1.Solve the actual production technical problems in the factory.
2.Work with pathfinding and innovation teams to provide solution for advanced package process.
3.Support cross-factory capability sharing and replication.
4.Generating IP’s for the company
5.Support the selection and certification of new equipment and materials
职位要求
Key Qualifications:
1.Ph.D. or MS degree in mechanical, chemical or material engineering, at least 8 years working experience is required
2.Prior experience in Laser Dicing process in advanced packaging.
3.Be proficient in the working principles and Laser Dicing process.
4.Wafer level process experience is desired, silicon BEOL process and equipment knowledge is a plus.
Preferred Skills:
1.Strong communication skills, Proficient English language capability.
2.experience work with global team members of different cultural backgrounds.
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