Vice President, Product Line Management

Strategy & Roadmap Partner with the executive team on business planning and define the short-, mid-, and long-term strategy and product roadmap for Optical Connectivity. Lead portfolio planning and governance, including new product initiation, platform/family expansion, portfolio consolidation, product replacement/upgrades, and end-of-life (EOL) strategy. Business Ownership & P&L Accountability Own product line performance across revenue, gross margin, cost, pricing, demand forecasting, and market share, ensuring growth and profitability targets are achieved. Lead feasibility assessments for new initiatives and drive resource prioritization across programs. Strategic Customers & Market Pull Engage directly with strategic customers and ecosystem partners (data centers/AI clusters, system OEMs, optical module vendors, OEM/ODM partners, etc.) to identify trends and pain points. Convert insights into actionable deliverables including MRD/PRD, specifications (SPEC), and cost/quality/lead-time targets. Drive customer adoption from sample validation through design-in, mass production ramp, and platform-level standardization to increase share and customer stickiness.

Education Bachelor’s degree or above; preferred majors include Mechanical Engineering, Materials Science, Electrical/Electronics, Optics, Telecommunications, Physics, or related disciplines. Advanced degree (MS/PhD) preferred. Industry Experience 15+ years of experience in optical communications / interconnect / connector-related industries. Proven leadership as a product line leader and/or in PLM/BU management roles (Director/VP level preferred). Experience with Molex, Corning, Senko, or comparable tier-1 global optical connectivity/connector companies is strongly preferred. Product & Technical Expertise Strong knowledge of optical connectivity products and applications, including high-density interconnect, blind-mate/backplane/board-level solutions, MPO/MT, LC families, and customized interconnect solutions. Experience with next-generation high-density dust-protected connector or system solutions (e.g., EBO, Shuffle Box, or equivalent architectures) is highly preferred.

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