Transmission-Advanced Tech Engineer

Lead the development of breakthrough 1.6T coherent transceivers, driving innovations in heterogeneous integration, Multi-Chip Module (MCM) packaging for next-generation 250GBd+ coherent transmission.  Co-design high-baud-rate DSPs, novel ADC/DACs, and Photonic Integrated Circuits (PICs) within advanced MCM substrates to minimize latency and power consumption.  Simulation of the designed signal flow with fiber link.  推动1.6T相干收发机的开发，推动了异构集成、多芯片模块（MCM）封装的创新，应用于下一代250GBd+相干传输。  共同设计高波特率数字信号处理器（DSP）、新型ADC/DAC和光子集成电路（PIC），在先进的MCM基板中实现最大延迟和功耗。  通过光纤链路模拟设计信号流

M.Sc. degree or above in optoelectronics, telecommunication or relevant.  Specialized coursework or research focus on fiber optic communications, coherent detection systems, or integrated photonics is highly preferred.  Background in advanced packaging technologies, heterogeneous integration, high-speed mixed-signal circuits, or optoelectronic interconnects  M.Sc.或以上学位，专业为光电子、电信或相关领域。  优先考虑专注于光纤通信、相干检测系统或集成光子学的专业课程或研究。  高级封装技术、异构积分、高速混合信号电路或光电子互连的背景  5+ years in optical transceiver development, with at least 1 years dedicated to coherent systems and deep, hands-on expertise in Multi-Chip Module (MCM) packaging.  Proven success in designing and mass-producing heterogeneous MCMs integrating Coherent DSPs  Experience optimizing PIC-to-fiber array coupling processes.  Ability to solve complex signal integrity (SI) and power integrity (PI) challenges in MCM environments, managing crosstalk and impedance matching at mmWave frequencies  Extensive experience working with tunable lasers, integrated silicon photonics (SiPh) platforms, or indium phosphide (InP) based coherent engines. 1 of 3  Knowledge in large baud-rate signal generation technologies, addressing bandwidth limitations in drivers and modulators for 1.6T applications.  Experience in coherent engine simulation in cope with coherent DSP.  Experience of working with various coherent engine vendors is a plus.  拥有5年+的光收发机开发经验，其中至少1年专注于相干系统和多芯片模块（MCM）封装的深入实践经验。  在设计和大规模生产集成相干数字信号处理的异构多单元模型方面取得了经过验证的成功  体验优化PIC到光纤阵列耦合过程的过程。  能够解决MCM环境中复杂的信号完整性（SI）和功率完整性（PI）问题，管理毫米波频段的串扰和阻抗匹配  拥有丰富的可调激光器、集成硅光子学（SiPh）平台或基于磷化铟（InP）的相干发动机工作经验。  掌握大波特率信号生成技术，解决1.6特斯拉应用中驱动和调制器的带宽限制。  在应对相干数字信号处理（DSP）中的相干发动机仿真经验。

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